While most through-hole components can be easily soldered with selective soldering, several critical parameters need to be optimized to ensure utmost end-product quality.
Newman Lake, WA (April 16, 2024) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. This technical paper encompasses critically important information and is entitled “An Essential Guide to Optimize Selective Soldering Processing.” This 8-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers. Topics covered within this publication include flux selection, flux application, thermal processing, no-clean thermal processing, flux residue mitigation, solder nozzle design, system flexibility, gold embrittlement, gold removal, and solderability testing.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.
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