Pulsar

Solderability Test Equipment

The Hentec/RPS Pulsar Solderability Test System is offered in single or dual pot configurations. The Pulsar uses a “dip and look” method and can be configured for low-volume lead tinning production. Designed for lab environments, the table-top system provides high precision PLC motion control, easy  touch  screen programming, and PID temperature management for complete process control. Hentec’s rapid custom tool holder fabrication can solve any odd-form or exotic component handling challenges.