While most through-hole components can be easily soldered with selective soldering, several critical parameters need to be optimized to ensure utmost end-product quality.

Newman Lake, WA (April 16, 2024) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. This technical paper encompasses critically important information and is entitled “An Essential Guide to Optimize Selective Soldering Processing.” This 8-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers. Topics covered within this publication include flux selection, flux application, thermal processing, no-clean thermal processing, flux residue mitigation, solder nozzle design, system flexibility, gold embrittlement, gold removal, and solderability testing.

About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.


If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or tbaro@rpsautomation.com.