Lead Tinning Equipment
The Odyssey series performs component re-conditioning — re-tinning, gold removal, and BGA de-balling — for high-reliability and military electronics. All three models are built to meet GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E, and ANSI-J-STD-002, and process a wide range of component types including DIP, SIP, QFP, BGA, and axial/radial leads.
Every Odyssey system is robotic hot solder dip, engineered and assembled in Newman Lake, Washington. Three models scale from mid-volume lab work to high-volume, high-mix production.
Not sure which model fits your volume?
| Model | Best for | Configuration | Standards compliance |
|---|---|---|---|
| Odyssey 925 | Mid-volume production tinning and re-tinning | Up to 4 stations — 40 lb. scavenge solder pot, dynamic flux, rinse, dynamic solder pot; direct-drive lead screw motion | GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E, ANSI-J-STD-002 |
| Odyssey 1325 | Mid-to-high volume, high-mix production; dual solder alloys | Auto load/unload; flux and solder stations, preheat, dynamic or static solder/dip flux baths, clean and dry stations | GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E, ANSI-J-STD-002 |
| Odyssey 1750 | High-volume, high-mix production; dual solder alloys | 8-station capable — batch load access, static scavenge solder pot, dynamic flux station, dynamic solder pot; can also solderability test | GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E, ANSI-J-STD-002 |