Hentec Industries/RPS Publishes Methods for Evaluating and Qualifying Selective Soldering Systems

There are numerous selective soldering systems available in today’s marketplace. This tech paper outlines a well-defined protocol for evaluating and qualifying candidate systems.

Newman Lake, WA (November 16, 2021) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published methods for evaluating and qualifying selective soldering systems.  This technical paper encompasses critically important information about selective soldering systems and is entitled “Practical Methods for Evaluating and Qualifying Selective Soldering Systems.”  This 7-page tech paper outlines essential information for circuit board assembly and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.

Topics covered within this publication include current and future application requirements, specification and feature analysis, key process parameters, machine qualification protocol, flux application methods, system flexibility and throughput, quality verification and operational costs

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit us at www.rpsautomation.com.

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If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or tbaro@rpsautomation.com.