Newman Lake, WA (May 4, 2021) – Hentec Industries/RPS Automation is pleased to announce that Retronix Ltd. has installed a Hentec/RPS Odyssey 1750 robotic hot solder dip machine in their Scotland facility.  The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys.  Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.  The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.

About Retronix

Founded in 1992, Retronix Ltd. provides technology solutions for electronics in high reliability sectors including alloy conversion and re-tinning, BGA de-balling and re-balling, and tin whisker mitigation solutions.  Headquartered in Scotland, Retronix has facilities worldwide including throughout Europe and North America.  For more information, please visit: www.retronix.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s.

All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit www.rpsautomation.com.

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If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or tbaro@rpsautomation.com.