TopLine Corporation Purchases Hentec/RPS Odyssey 1750 Component Lead Tinning System

Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Newman Lake, WA (June 28, 2022) – Hentec Industries/RPS Automation is pleased to announce that TopLine Corporation has finalized the purchase of a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning machine.  The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys.  Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.  The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.

About TopLine Corporation

Headquartered in Orange, California, TopLine Corporation is a major supplier of electronic components for the defense and aerospace assembly industry.  Their products and services are distributed on a global basis to multiple countries around the world.  For more information, please visit:

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit us at


If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or