Newman Lake, WA (October 26, 2021) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that ePAK International has purchased a Pulsar solderability system. The Pulsar utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder.  An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system.  The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.

About ePAK International

Headquartered in Austin, Texas, ePAK International offers a full range of semiconductor manufacturing solutions from front end, wafer handling to final packaging for a wide range of worldwide customers.  They have global facilities throughout Asia, Europe, and North America.  For more information please visit: www.epak.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit us at www.rpsautomation.com.

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If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or tbaro@rpsautomation.com.